Loading...
News Article

HRL Labs to Offer GaN MMIC Foundry Service

News

Custom integrated circuits for specific applications can be designed and fabricated at much lower cost

HRL Laboratories, - a corporate research lab owned by Boeing and General Motors in the US- has announced a new shared foundry service, offering advanced millimetre-wave (mmW) GaN technology for fabrication of monolithic microwave integrated circuits (MMICs) through multi-project wafer (MPW) runs.

"Eligible customers will be able to design into our world-class, state-of-the-art mmW T3-GaN fabrication process and receive custom, tailored circuits for their specific applications at a price much lower than a dedicated foundry run," said Shawn Burnham, the HRL scientist in charge of the GaN foundry service. "They will be given access to a process design kit, which has already been used to demonstrate world-record power amplifier and low-noise amplifier performance."

HRL T3-GaN is a leading-edge mmW HEMT technology for applications such as next-generation high-data-rate wireless communications and high-resolution radar imaging.

HRL processes GaN wafers in a 10,000-square-foot ISO Class 4 cleanroom, and is a US Department of Defense Trusted Foundry. HRL will begin an open subscription period soon for customers with verified US government end-use of the foundry product.

For customers that do not want to perform custom MMIC designs themselves, HRL also continues to offer related T3-GaN MMIC design services to US Government customers, which could then be used on MPW runs.

HRL has over 25 years of experience designing MMICs from UHF to mmW, including low-noise amplifiers, power amplifiers, mixers, switches, attenuators, and phase shifters, and the expertise to package the fabricated MMICs.

Say hello to the heterogeneous revolution
Double heterostructure HEMTs for handsets
AlixLabs to collaborate with Linköping University
SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: