Loading...
News Article

Fraunhofer efficiency record for Tandem Solar Cells

News

Record 22.3 percent efficiency for tandem of III-V layers on silicon

Scientists at Fraunhofer ISE in cooperation with partners have achieved a new efficiency record of 22.3 percent for a multi-junction solar cell made of silicon and III-V semiconductor materials. The achievement is that the III-V layers were directly grown on the silicon.

By combining different semiconductor materials, solar cell researchers are attempting to surpass the theoretical efficiency limit of 29.4 percent for a single-junction silicon solar cell, and convert sunlight into electricity even more efficiently.

A promising approach is to combine silicon with III-V semiconductor compounds like GaAs. To realise this, one method is to first deposit the III-V solar cell structures on GaAs substrates, then transfer to a silicon solar cell using semiconductor bonding technology and lastly etch away the GaAs substrate. Another less costly approach, however, is to directly grow the III-V layers on the silicon solar cell.

In the second approach, the atomic structure must be controlled extremely well during growth so that the gallium and phosphorous atoms arrange on the correct lattice sites at the interface to the silicon material. Also, the distance between the atoms in the crystal lattice must be increased in order to produce the GaAs material. Researchers have been working on these challenges for over ten years. Now they have been able to greatly reduce the defect density in the III-V semiconductor layers on the silicon and have successfully produced a III-V/Si tandem solar cell with a new efficiency record of 22.3 percent using this direct-growth approach.

The efficiency value was published in the internationally recognised table of the best research-cell efficiencies worldwide on December 25, 2018.


“We are delighted with this result for the direct growth of III-V semiconductors on silicon, an important research approach for tandem solar cells,” says Andreas Bett, institute director of Fraunhofer ISE. “In Freiburg, we are presently building a new research centre for high efficiency solar cells. Our work on tandem cells will be carried out in the new facilities upon its completion in 2020. With the improved technical infrastructure, we expect the developments in multi-junction solar cells based on silicon to accelerate rapidly.”

Within the MehrSi project over the past years, the junction between the silicon crystal and the first III-V semiconductor layer of GaP was investigated and continuously optimised in close cooperation with the research groups of Thomas Hannappel on the TU Ilmenau and of Kerstin Volz at the Philipps University Marburg. The defects in the crystalline structure were first made visible and then reduced step by step. “The record efficiency of our III-V/Si tandem solar cell demonstrates that we have achieved a very good understanding of the materials,” explains Frank Dimroth, coordinator of the MehrSi project. With the successful direct growth of III-V layers on silicon, we can avoid using expensive III-V substrates for epitaxy. This approach is, therefore, a key technology for the cost-effective manufacture of high efficiency tandem solar cells in the future.

The MehrSi project, in which the record multi-junction solar cell on silicon was created, was financed by the German Federal Ministry for Education and Research BMBF. The project partners were the TU Ilmenau, the Philipps University of Marburg and the system manufacturer Aixtron SE.

SiC MOSFETs: Understanding the benefits of plasma nitridation
Wolfspeed reports Q2 results
VueReal secures $40.5m to scale MicroSolid printing
Mitsubishi joins Horizon Europe's FLAGCHIP project
Vishay launches new high voltage SiC diodes
UK team leads diamond-FET breakthrough
GaN adoption at tipping point, says Infineon
BluGlass files tuneable GaN laser patents
QD company Quantum Science expands into new facility
Innoscience files lawsuit against Infineon
Riber revenues up 5% to €41.2m
Forvia Hella to use CoolSiC for next generation charging
Photon Design to exhibit QD simulation tool
Ortel transfers CW laser fabrication to Canada
Luminus adds red and blue multi-mode Lasers
PseudolithIC raises $6M for heterogeneous chiplet tech
Mesa sidewall design improves HV DUV LEDs
IQE revenue to exceed expectations
'Game-changing' VCSEL system targets clinical imaging
German start-up secures finance for SiC processing tech
Macom signs preliminaries for CHIPS Act funding
IQE and Quintessent partner on QD lasers for AI
EU funds perovskite tandems for fuel-free space propulsion
EU to invest €3m in GeSi quantum project
Transforming the current density of AlN Schottky barrier diodes
Turbocharging the GaN MOSFET with a HfO₂ gate
Wolfspeed launches Gen 4 SiC MOSFET technology
Report predicts high growth for UK's North East
Element Six unveils Cu-diamond composite
SemiQ launches hi-rel 1700V SiC MOSFETs
Lynred to exhibit Eyesential SWIR sensor for machine vision
Thorlabs buys VCSEL firm Praevium Research
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Compound Semiconductor Magazine, the Compound Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: